Technical Deployment Lead, Semiconductors

Responsibilities

• Own technical delivery plans for multiple interdependent workstreams, translating customer objectives into roadmaps with milestones, dependencies, and acceptance criteria.
• Drive day-to-day execution across Forward Deployed Engineers, researchers, customer engineers, and semiconductor customer teams.
• Make scope, sequencing, and priority trade-offs to protect critical paths and deliver production deployments.
• Embed with semiconductor customers to map workflows, define success criteria, shape tools and integrations, and drive adoption and change management.
• Integrate solutions with customer infrastructure, data systems, engineering toolchains, and export-controlled environments.
• Partner with Product and Research to align platform components and research workstreams with deployment goals.
• Codify reusable solution patterns and evaluations, and share field insights to inform product and model roadmaps.
• Define value cases, baselines, KPIs, and pre-/post-deployment impact measurement for executive sponsors.
• Travel to customer sites approximately 25–50% of the time.

Requirements

• 7+ years of customer-facing technical delivery leadership experience.
• Deep semiconductor workflow expertise, including RTL design, verification, EDA tooling, and physical implementation.
• Experience leading large, complex, high-stakes customer engagements involving tight coordination and rapid decision-making.
• Strong technical project management, sequencing, architecture evaluation, and trade-off judgment.
• Ability to translate between system-level strategy, customer workflows, technical constraints, and execution details.
• Experience shipping AI or large language model systems, including production integrations and deployment patterns.
• Strong executive communication and customer-facing translation skills.
• Ability to operate autonomously in ambiguous, high-trust environments.

Compensation

• Annual salary: $176,000–$224,000.