Packaging Engineering Intern
Hands-on winter internship developing and integrating semiconductor packaging equipment and processes. Candidates should be pursuing an engineering degree, have lab and prototyping experience, and provide a portfolio of built projects.
About the job
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, including laser ablation machines, reflow ovens, and automated metal plating facilities.
- Integrate mechanical, electrical, and optical components during system assembly, including wiring, optics alignment, and electronics.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Perform hands-on package and wafer processing, including 3D printing, metal plating, lithography, and metrology.
Requirements
- Pursuing a bachelor's degree or higher in engineering.
- At least 1–2 hands-on wet-lab or lab-adjacent experiences, ideally involving metal plating or device fabrication.
- Strong foundation in mechanical engineering, including SolidWorks or Onshape and materials selection.
- Hands-on prototyping experience and ability to move quickly through design cycles.
- Portfolio demonstrating built projects or shipped medium- to high-complexity systems.
Nice-to-haves
- Mechatronics or electromechanical system design experience.
- Familiarity with lasering and stereolithography 3D printing.
- Reliability testing, soldering, and reflow testing.
- Experience with nanofabrication tools such as etching, deposition, and patterning.
- Experience with metrology tools such as SEM, thin-film measurement, and X-ray inspection.
Compensation and Benefits
- Hourly compensation equivalent to an annualized range of $108,000–$126,000, depending on experience and education; actual earnings vary with hours worked.
- Housing stipend, daily lunches, dinners three times per week, stocked office kitchen, learning and development opportunities, commuter benefits, paid time off, visa sponsorship, medical, dental and vision insurance, 401(k), and life and disability insurance.
Skills
Solidworks, Onshape, Mechanical Engineering, Mechatronics, Electromechanical Design, 3D Printing, Metal Plating, Lithography, Metrology, Soldering, Reflow Testing, Scanning Electron Microscopy
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