Packaging Engineering Intern
Hands-on semiconductor packaging intern designing, prototyping, and testing fabrication equipment and processes. Candidates should be pursuing an engineering degree, have lab or device-fabrication experience, and demonstrate substantial prototyping work through a portfolio.
About the job
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, including laser ablation machines, reflow ovens, and automated metal-plating facilities.
- Integrate mechanical, electrical, and optical components during system assembly, including wiring, optics alignment, and electronics.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Perform hands-on package and wafer processing, including 3D printing, metal plating, lithography, and metrology.
Requirements
- Pursuing a bachelor's degree or higher in engineering.
- At least 1–2 hands-on wet-lab or lab-adjacent experiences, ideally involving metal plating or device fabrication.
- Strong foundation in mechanical engineering, including SolidWorks or Onshape and materials selection.
- Hands-on prototyping experience and the ability to move quickly through design cycles.
- Portfolio demonstrating built systems or projects.
Nice-to-haves
- Mechatronics or electromechanical system design experience.
- Familiarity with laser processing and stereolithography-based 3D printing.
- Reliability testing, soldering, and reflow testing experience.
- Experience with nanofabrication tools such as etching, deposition, and patterning.
- Experience with metrology tools such as SEM, thin-film measurement, and X-ray inspection.
Compensation and Benefits
- Hourly pay equivalent to an annualized range of $108,000–$126,000, depending on experience and education; actual earnings vary with hours worked.
- Housing stipend, daily lunches, dinners three times per week, stocked kitchen, learning and development opportunities, commuter benefits, paid time off, visa sponsorship, medical, dental and vision insurance, 401(k), and life and disability insurance.
Skills
Mechanical Engineering, Solidworks, Onshape, Mechatronics, 3D Printing, Metal Plating, Lithography, Metrology, Soldering, Reflow Testing, Semiconductor Packaging, Laser Ablation, Optics Alignment, Scanning Electron Microscopy, Thin-Film Measurement
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