PCB Layout Engineer
Executes complex PCB layouts for autonomous drones, including stack-up design, high-density placement, and precision routing. Collaborates with EE, RF, and mechanical teams to ensure performance, reliability, and manufacturability; requires 5+ years expertise in Cadence Allegro/OrCAD.
About the job
How you'll make an impact
- Own layout of Skydio’s complex PCBAs for next generation products: outline definition, stack-up design, high-density placement, precision routing, and release to manufacturing.
- Establish and maintain design standards, libraries, and workflows to ensure consistency and scalability across multiple product generations.
- Partner closely with electrical, mechanical, RF, and manufacturing engineers to resolve trade-offs and deliver robust, manufacturable designs.
- Collaborate with PCB fabrication and assembly vendors to ensure impedance control, compliance with DFM/DFT rules, and reliable production yields.
- Drive continuous improvement in tool flows, library management, and design review processes, including opportunities for automation.
What makes you a good fit
- Deep expertise in hands-on PCB layout for high-speed, high-density, and mixed-signal systems (5+ years preferred).
- Expert in Cadence Allegro/OrCAD (17.2/25.1), with a proven track record designing and shipping complex boards.
- Strong grasp of component placement, signal integrity, power integrity, EMI/EMC, and impedance control principles, with practical application in layouts.
- Proficient in rigid, flex, and rigid-flex PCB design for high-performance embedded systems.
- Excellent organizational and communication skills, with experience collaborating across EE, ME, RF, and manufacturing teams.
(Nice to have) Familiarity with scripting/automation in PCB tools, PLM systems, or experience with robotics/drones.
Compensation
Annual base salary range: $147,500 - $210,000. Includes equity (stock options), comprehensive benefits, paid vacation, sick leave, holidays, 401K.
Skills
Cadence Allegro, Orcad, Pcb Layout, Signal Integrity, Power Integrity, Emi/Emc, Impedance Control, Rigid-Flex Pcb, High-Density Placement, Dfm/Dft
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