Rack Systems Architect, Technical Lead
Own the architecture and deployment of dense, liquid-cooled rack-scale AI compute products while leading electrical, mechanical, thermal, and integration engineers. The role requires 10+ years of rack-scale systems architecture experience and a record of shipping NVL-class or equivalent products.
About the job
Responsibilities
- Own rack-scale compute products for 150 kW-class liquid-cooled deployments, including architecture, power budgets, cooling, interconnect topology, structure, weight, transport, and serviceability.
- Define and maintain interface control documents between racks and facilities so power, liquid, and network systems can evolve independently.
- Lead EE, ME, thermal, and integration engineers and own the architecture and technical decisions they execute.
- Run rigorous design reviews and resolve issues before integration or deployment.
- Align rack roadmaps with accelerator vendors and facility architecture.
Requirements
- 10+ years of experience in system architecture for rack-scale compute at a hyperscaler, NVIDIA-ecosystem ODM, or AI systems company.
- End-to-end ownership of rack products, including power, cooling, interconnects, weight, transport, and serviceability.
- Experience shipping dense liquid-cooled, NVL-class or equivalent rack-scale products.
- Experience leading electrical, mechanical, and thermal engineering teams.
- Experience making and defending system-level tradeoffs on production racks.
- Experience writing interface control documents.
- Ability to evaluate copper versus optical scale-up interconnects at 200G+ per lane.
Nice to Have
- NVL-class rack programs.
- Transport and seismic qualification experience.
- Facility-side liquid cooling expertise.
- Direct engagement with accelerator vendor roadmaps.
Compensation
- Annual salary range: $208,000–$263,000.
Skills
System Architecture, Rack-Scale Computing, Liquid Cooling, Power Budgeting, Interconnect Topology, Interface Control Documents, Electrical Engineering, Mechanical Engineering, Thermal Engineering, Copper Interconnects, Optical Interconnects, Seismic Qualification
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