PCB Layout Engineering Lead

Responsibilities

• Own multilayer PCB layout from component placement through fabrication and assembly release.
• Translate schematics, mechanical constraints, and electrical requirements into constraint-driven board designs.
• Define board stackups, controlled-impedance structures, routing rules, reference planes, return paths, and length- and phase-matching constraints.
• Place and route high-speed digital, high-current power, and sensitive analog circuits, including dense BGA fanout and differential interfaces.
• Apply signal-integrity and power-integrity practices to minimize crosstalk, discontinuities, noise, voltage drop, and EMI.
• Collaborate with electrical, SI/PI, mechanical, thermal, compliance, manufacturing, and test engineers.
• Work with fabrication and assembly partners to validate stackups and via structures and improve yield, cost, and schedule.
• Perform design reviews and DFM, DFA, and DFT checks.
• Generate and verify fabrication drawings, assembly drawings, drill data, Gerbers, ODB++, IPC-2581, and related release packages.
• Maintain component footprints, padstacks, design libraries, layout standards, and release documentation.
• Support prototype builds, board bring-up, failure analysis, and production layout revisions.

Requirements

• Bachelor’s degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience.
• 10+ years of hands-on experience laying out complex, high-speed, multilayer printed circuit boards.
• Expertise with Cadence Allegro PCB Designer and Constraint Manager; experience with Altium Designer or equivalent tools.
• Strong knowledge of component placement, controlled-impedance routing, differential pairs, length matching, return-path continuity, and power distribution.
• Experience with dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling.
• Working knowledge of signal integrity, power integrity, EMI/EMC, thermal design, creepage and clearance, and high-current routing.
• Experience applying IPC standards and fabrication, assembly, test, and manufacturability requirements.
• Ability to create and review complete PCB fabrication and assembly release packages.
• Experience working on server hardware, AI accelerators, datacenter hardware, GPUs, CPUs, TPUs, or server platforms.
• Ability to work in a fast-paced environment and collaborate effectively with multidisciplinary teams.

Preferred Qualifications

• Experience designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems.
• Experience routing DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes interfaces.
• Experience with high-current, low-voltage power delivery, VRM placement, decoupling strategy, copper balancing, and thermal optimization.
• Experience developing Allegro SKILL scripts or other automation for layout and release efficiency.
• Demonstrated success delivering first-pass functional boards and supporting products from prototype through volume production.

Compensation

• Base salary range: $210,000–$230,000+ annually.
• Additional compensation may include bonus and equity.