Advanced Packaging Reliability Engineer
Lead reliability engineering for advanced HPC packages in AI systems. Assess mechanical/thermal risks, develop test plans, perform modeling, and drive design optimizations with cross-functional teams.
Senior Harness Engineer responsible for designing, integrating, and validating custom wire harnesses and FPCs for advanced robotic systems from architecture through production. Requires 7+ years experience, strong electromechanical intuition, and cross-functional collaboration with mechanical, electrical, and manufacturing teams.
Lead reliability engineering for advanced HPC packages in AI systems. Assess mechanical/thermal risks, develop test plans, perform modeling, and drive design optimizations with cross-functional teams.
Technical leader owning compute qualification, first-silicon and new-platform validation, test automation, and root-cause failure analysis for AI compute infrastructure. Requires senior hardware validation or systems engineering experience with early hardware qualification and automation ownership.
Lead the hardware qualification lab for next-gen compute, network, and rack systems ahead of large-scale AI infrastructure deployment. Own qualification roadmap, lab operations, vendor relationships, and final standardization decisions backed by test data.
Lead mechanical commissioning (Levels 1-5) for high-performance AI data centers, owning testing/verification, documentation, on-site operations, and handover for cooling, heat rejection, and liquid cooling systems. Requires 10+ years hands-on data center mechanical commissioning experience and a Mechanical Engineering degree.
Design and develop next-generation Wafer Scale Engine chips with deep RTL expertise, focusing on high-performance, power-efficient micro-architecture and integration. Requires 8+ years RTL experience and a Master's degree.