Advanced Packaging Reliability Engineer

Responsibilities

• Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development.
• Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability.
• Develop, validate, and apply package reliability models and lifetime-prediction methodologies for assembly, qualification, and product operating conditions.
• Evaluate and recommend package architectures, structural designs, materials, and assembly processes to maximize reliability performance and manufacturing robustness.
• Predict electromigration lifetime of package interconnects under product-specific current, temperature, workload, duty-cycle, and PCB boundary conditions.

Requirements

• 8+ years of industry experience & knowledge of semiconductor package reliability principles and failure mechanisms, including electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, and material degradation.
• In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
• Demonstrated experience leading package failure investigations, performing root-cause analysis, and implementing effective design, material, process, or manufacturing corrective actions.
• Strong experience with thermal and mechanical finite-element modeling of packages, including temperature distribution, warpage, stress, strain, fatigue, and interfacial reliability.
• Strong understanding of package-material behavior, including coefficient of thermal expansion, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity, and temperature-dependent properties.

Nice-to-Haves

• Experience developing electromigration or interconnect lifetime models for solder joints, vias, redistribution layers, interposers, or package power-delivery structures.
• Knowledge of package qualification methods, acceleration models, thermal cycling, power cycling, current-stress testing, and reliability lifetime extrapolation.
• Familiarity with package failure-analysis techniques such as acoustic microscopy, X-ray imaging, cross-sectioning, scanning electron microscopy, and material characterization.
• Experience supporting package-integrated voltage regulation, high-current power delivery, or high-transient-current AI and HPC products.
• MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
• Strong communication, cross-functional collaboration, and technical leadership skills.