FluidstackAustin, TXLead mechanical commissioning (Levels 1-5) for high-performance AI data centers, owning testing/verification, documentation, on-site operations, and handover for cooling, heat rejection, and liquid cooling systems. Requires 10+ years hands-on data center mechanical commissioning experience and a Mechanical Engineering degree.
Design and develop next-generation Wafer Scale Engine chips with deep RTL expertise, focusing on high-performance, power-efficient micro-architecture and integration. Requires 8+ years RTL experience and a Master's degree.
Leads mechanical cooling strategy and design for large-scale AI data centers, owning systems from chip to chiller across multi-site portfolios. Manages engineering team, modular prefab development, and vendor coordination for high-density GPU deployments (75–150+ kW/rack). Requires 10+ years data center cooling experience and BS in Mechanical Engineering.
Lead reliability engineering for advanced HPC packages in AI systems. Assess mechanical/thermal risks, develop test plans, perform modeling, and drive design optimizations with cross-functional teams.
Senior RTL engineer owning microarchitecture and RTL implementation of scalable on-chip and off-chip interconnect fabrics for custom AI accelerators. Requires deep Verilog/SystemVerilog expertise and experience delivering complex SoC interconnects through tape-out.
Lead mechanical engineering for complex electromechanical consumer hardware products. Manage a small team of mechanical, soft goods, and prototype engineers while providing hands-on technical leadership from concept through high-volume production.