Power Engineering Architect
Leads power delivery architecture and technology development for high-performance AI and advanced ASIC platforms, covering electrical performance, thermal management, vendor strategy, and production deployment. Requires a master’s degree or equivalent experience and 15+ years in power delivery systems.
About the job
Responsibilities
- Lead system architecture exploration focused on power delivery and thermal management.
- Drive innovation in vertical power delivery to the wafer for ultra-high current-density solutions.
- Collaborate with product, ASIC, and systems teams to define and refine detailed power specifications.
- Architect power delivery systems optimized for electrical performance and cooling efficiency.
- Evaluate and select architectures and strategic partners or vendors for new technology development.
- Oversee power delivery solutions from concept through production deployment.
- Collaborate with package, silicon, PCB, and mechanical teams to optimize power delivery.
Requirements
- MSEE, MSCE, or equivalent industry experience required; PhD preferred.
- 15+ years of hands-on experience in power delivery systems.
- Strong foundation in energy-efficient system design and associated trade-offs.
- Practical experience with thermal modeling and cooling solution implementation.
- Experience with high-current, low-voltage power delivery for advanced silicon.
- Experience with multiphase buck regulators, digital power controllers, DrMOS, smart power stages, and integrated voltage regulators.
- Experience working on server hardware, AI accelerators, hardware accelerators, data centers, enterprise products, GPUs, CPUs, TPUs, or server platforms.
- Excellent interpersonal skills and a collaborative mindset.
Preferred Qualifications
- Expertise in DC-DC power conversion, including control loops, power management, magnetics, and filter design.
- Background in semiconductor technologies, including PMICs and integrated power modules.
- Deep technical knowledge of magnetic components, especially custom inductor design.
- Experience developing advanced power modules with optimized thermal and magnetic characteristics.
- Experience with package PDN design, power vias, bumps, interposers, substrates, and ASIC power delivery structures.
- Expertise in power architecture for chiplet-based designs, IVRs, advanced packages, or 2.5D/3D integration.
Compensation
- Base salary: $230,000–$275,000+ annually.
- Additional compensation may include bonus and equity.
Skills
Power Delivery, Thermal Modeling, Dc-Dc Conversion, Multiphase Buck Regulators, Digital Power Controllers, Drmos, Smart Power Stages, Integrated Voltage Regulators, Pmics, Magnetics, Custom Inductor Design, Package Pdn Design, Asic Power Delivery, Chiplet Architecture, 2.5D/3D Integration
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