Lead Systems Signal Integrity/Power Integrity Engineer
Leads system-level signal integrity and power integrity analysis for high-speed AI compute hardware across silicon, packages, PCBs, flex circuits, and connectors. Requires a master's degree in electrical engineering and 15+ years of experience with advanced SI/PI simulation, hardware correlation, and high-performance computing systems.
About the job
Responsibilities
- Solve complex signal integrity and power integrity problems for high-speed AI compute platforms, including chip-to-chip and chip-to-board interfaces.
- Perform pre-layout and post-layout SI/PI analysis across PCBs, flex circuits, rigid-flex assemblies, connectors, and advanced packages.
- Lead root-cause analysis of margin shortfalls, impedance discontinuities, coupling, resonances, and simulation-to-hardware mismatches.
- Analyze and resolve SI/PI challenges involving flex circuits, high-speed flex connectors, interposers, and advanced packaging technologies.
- Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation.
- Define PCB, rigid-flex, and flex-circuit stack-ups, material selections, and impedance structures to meet performance targets.
- Review schematics, PCB layouts, and flex designs to identify SI/PI risks and recommend design changes.
- Collaborate with silicon and package design teams on bump/ball assignments, package-to-PCB transitions, and interface interactions.
- Act as the technical escalation point for complex SI/PI issues across multiple programs.
Requirements
- Master's degree in Electrical Engineering.
- 15+ years of experience in system-level signal integrity and power integrity engineering for high-speed hardware systems.
- Deep expertise in high-speed serial and parallel interface analysis and debugging.
- Hands-on experience with PCB, rigid-flex, and flex-circuit stack-up design and analysis.
- Advanced SI/PI analysis of flex connectors, high-density interconnects, and advanced packaging technologies.
- Proficiency with 2D and 3D electromagnetic simulation tools.
- Experience with system-level power delivery network analysis, simulation, and lab correlation.
- Strong grounding in transmission line theory, microwave engineering, and high-speed design fundamentals.
- Ability to correlate simulation results with hardware behavior and implement design fixes.
- Experience with server hardware, AI accelerators, hardware accelerators, datacenter systems, enterprise products, GPUs, CPUs, TPUs, or server platforms.
Nice to Have
- Experience with large-scale AI or high-performance computing systems.
Compensation
- Base salary: $220,000–$250,000+ annually.
- Additional compensation may include bonus and equity.
Skills
Signal Integrity, Power Integrity, Pcb Design, Rigid-Flex, Flex Circuits, Electromagnetic Simulation, Power Delivery Networks, Transmission Line Theory, Microwave Engineering, High-Speed Interfaces, Advanced Packaging, Impedance Analysis, Hardware Correlation, Ai Accelerators, Server Hardware
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