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AnthropicAnthropic

Technical Program Manager, Silicon

Own end-to-end execution of custom silicon programs from architecture through tapeout, bring-up, and production, coordinating internal engineering teams and external partners. Requires 8+ years of silicon or SoC program leadership, production tapeout experience, and broad lifecycle fluency.

About the job

Responsibilities

  • Own the integrated silicon program plan, including architecture closure, RTL freeze, design verification milestones, IP delivery, physical-design closure, DFT, tapeout, and post-silicon bring-up.
  • Drive execution across ASIC design partners, IP vendors, foundries, and packaging/test providers.
  • Run technology and IP selection, evaluate vendors and options, and drive build, buy, and license decisions with engineering leadership.
  • Build lightweight execution mechanisms, including milestone definitions, risk and dependency tracking, design reviews, release management, and executive reporting.
  • Manage interfaces between silicon and hardware systems, including package, board, and bring-up activities, as well as inference, kernel, and compiler teams for hardware-software co-design.
  • Own post-silicon activities, including bring-up planning, ATE/test handoff, sample distribution, validation, and production readiness.
  • Develop AI-assisted approaches to program management, including schedule and dependency modeling, specification and milestone consistency checking, partner-deliverable tracking, and status synthesis.

Requirements

  • 8+ years in silicon or SoC program management, chip leadership, or an equivalent role owning a chip schedule end to end.
  • Direct ownership of at least one program that taped out and reached production.
  • Technical fluency across the silicon lifecycle, including front-end design, design verification, physical design, DFT, foundry operations, and packaging.
  • Experience managing external silicon partners, including ASIC houses, IP vendors, foundries, or OSAT providers; SOW scoping, delivery tracking, and escalation.
  • Experience building program mechanisms from scratch for ambiguous, fast-moving efforts.
  • Strong written communication for plans, reviews, and executive updates.
  • Comfort operating autonomously with limited process.
  • Bachelor's or master's degree in electrical engineering, computer engineering, computer science, or a related field, or equivalent experience.

Preferred Qualifications

  • Experience with ML accelerators, high-performance computing, networking, or other large, high-bandwidth SoCs at advanced process nodes.
  • Experience with first-generation or early silicon programs, including establishing flows, methodology, or vendor relationships.
  • Experience with both partner-executed and fully in-house programs.
  • Hands-on engineering experience in design, design verification, physical design, DFT, or SI/PI.
  • Familiarity with chip-package-system interfaces and co-design with hardware systems teams.
  • Experience with hardware-software co-design involving compiler, kernel, or runtime teams.
  • Practical experience using AI tools in professional workflows.

Compensation

  • Annual salary: $365,000–$435,000 USD
  • Hybrid policy: Staff are expected to work from an office at least 25% of the time; some roles may require more office time.
  • Visa sponsorship may be available depending on the role and candidate.

Skills

Soc, Asic, Rtl, Design Verification, Physical Design, Dft, Tapeout, Foundry, Osat, Packaging, Hardware-Software Co-Design, Compilers, Kernels, AI Tools

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