Packaging Engineering Intern - Fall
Hands-on intern designs and iterates semiconductor packaging machines/subsystems, integrates mechanical/electrical/optical components, and performs wafer processing. Requires engineering student status, 1-2 lab experiences, mechanical engineering foundation, and prototyping portfolio.
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
- Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
- Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
- Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Required Experience
- Pursuing a Bachelor’s Degree or higher in engineering
- At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
- Hands-on prototyping experience and the ability to move through design cycles quickly
Nice-to-have
- Proven experience in mechatronics or electromechanical system design
- Familiarity with lasering and 3D printing (stereolithography)
- Reliability testing, soldering, and reflow testing
- Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)
Compensation
- Hourly rate equivalent to annualized $90,000-126,000 (40-hour week + up to 10 hours overtime at 1.5x)
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