Physical Design Engineer
Design and analyze 3D integrated ASIC/SoC products, performing physical verification, power/clock/cooling analysis, and collaborating with RTL teams on novel 3D packaging concepts. Requires 10+ years of physical design experience and expertise with ICV/Calibre, IR/EM, and scripting.
About the job
Responsibilities
- Design and analysis of 3D integrated products
- Work on traditional ASIC/SoC physical design, packaging, power, clock, and cooling analysis
- Collaborate with architecture and RTL teams on R&D for novel 3D integration concepts
- Perform block-level and full-chip physical verification
- Optimize for power, performance, and area
- Execute complete physical design flow
- Resolve block and full-chip DRC and LVS issues using ICV or Calibre
- Conduct IR/EM analysis and resolution
- Create flow enhancements using scripting (Tcl, Python)
- Work with RTL teams to optimize physical design
- Apply knowledge of 2.5D or 3D packaging solutions, 3D physical design, 3D die stacking, 3D chip design, die-to-die or wafer-to-wafer
Requirements
- 10+ years of physical design/verification experience
- Strong knowledge of block level and full-chip physical verification methodology
- Expert at optimizing for power/performance and area
- Experience with complete physical design flow; Synopsys tool suite knowledge is a plus
- Expert with ICV or Calibre tools for DRC and LVS issues
- Expert with IR/EM analysis and resolution
- Strong scripting ability in Tcl and Python for flow enhancements
- Demonstrated ability to work with RTL teams
- Knowledge of 2.5D or 3D packaging solutions
- Experience with 3D physical design, 3D die stacking, 3D chip design, die-to-die or wafer-to-wafer
Nice-to-Haves
- Experience with full chip floor planning and integration
- Knowledge of clock distribution
- Knowledge of cooling analysis
Compensation
- Salary range: $230,000 – $280,000 annually
- Actual compensation based on experience, skills, qualifications, and location
Skills
Physical Design, Asic, Soc, Physical Verification, Synopsys, Icv, Calibre, Drc, Lvs, Ir/Em Analysis, Tcl, Python, Rtl, 3D Integration, 2.5D Packaging
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