Systems Debug Engineer

Responsibilities

• Characterize failure signatures and perform hands-on troubleshooting at the system, board, and component level.
• Drive failure analysis to root cause—down to silicon, PCB, or external components—using structured, first-principles problem solving.
• Remotely diagnose failures in deployed systems using Linux command-line tools, system logs, telemetry, diagnostic utilities, and remote-access workflows.
• Analyze and document results clearly, and provide actionable recommendations to design and manufacturing teams.
• Interface across internal groups (ASIC, systems, and manufacturing) and with external vendors to resolve issues and close corrective actions.
• Participate in design reviews for next-generation systems, contributing recommendations spanning electrical design-for-test (DFT), mechanical, and thermal improvements.

Skills & Qualifications

Required:

• Bachelor’s degree in Electrical Engineering or a related field.
• 3-5+ years of experience in hardware bring-up, system integration, board/system debug, or failure analysis.
• Strong analytical, diagnostic, and problem-solving skills, grounded in first principles.
• Strong drive to self-educate and operate with autonomy in fast-moving, ambiguous environments.
• Hands-on experience with oscilloscopes and standard electrical bench instrumentation.
• Scripting experience, preferably Python, for data analysis and automation.
• Excellent communication skills, with the ability to distill complex technical findings into clear, concise insights.

Preferred:

• Comfort working in Linux environments and using command-line interfaces to inspect logs, query system state, run diagnostics, and troubleshoot compute hardware.
• Experience with failure analysis (FA) techniques such as cross-section, SEM, and X-ray.
• Experience working with Contract Manufacturers and implementing process and design level changes.
• Experience reading electrical schematics and board layouts.
• Familiarity with PCB design and assembly processes (e.g., PCB surface finishes, convection reflow, and solder properties).
• Understanding of thermal, electrical, and mechanical interactions in high-performance systems.