Senior Process Engineer - Physical Vapor Deposition

Responsibilities

Core Responsibilities

• Own the process health and performance of assigned PVD modules through SPC, process monitoring, and data analysis.
• Develop, optimize, and qualify thin-film deposition processes for superconducting resonators, signal wiring, and interconnect structures, including qualification of new equipment, materials, and process technologies.
• Analyze process, metrology, and electrical characterization data to improve reproducibility and device performance.
• Lead root-cause investigations and implement corrective and preventive actions for process, equipment, and materials-related issues, including issues requiring cross-functional coordination.
• Partner with facilities and equipment engineering to coordinate preventive maintenance, support equipment recovery, and lead process qualification following maintenance or repairs.
• Document process development activities, author and maintain standard operating procedures, and train process technicians on new processes and equipment operation.

Growth and Stretch Responsibilities

• Contribute to and, with increasing scope, help set the technical roadmap for the process area, including equipment strategy, capability investments, and long-term scalability.
• Mentor and technically review the work of process engineers or technicians as opportunities arise.
• Represent process engineering in cross-functional design and technical reviews, helping drive trade-off decisions across materials, process integration, design, and quantum engineering.

Requirements

• Master's degree with 4–6 years of relevant industry or research experience, or a PhD with 2+ years of relevant industry, postdoctoral, or research experience, in Materials Science, Physics, Applied Physics, Electrical Engineering, Chemical Engineering, or a related field.
• Hands-on experience with PVD equipment, including sputtering, e-beam, or thermal evaporation, and semiconductor fabrication processes.
• Direct, sustained experience with 4-inch or 6-inch wafer processing.
• Strong working knowledge of vacuum systems and thin-film deposition processes, including diagnosing process or tool drift.
• Strong understanding of semiconductor fabrication processes and superconducting or semiconductor device physics.
• Experience with process development, experimental design (DOE), and engineering data analysis, including using data to drive process decisions.
• Strong written and verbal communication skills, including technical documentation.
• Ability to work effectively in a collaborative, cross-functional engineering environment.
• Comfort operating autonomously in a fast-paced R&D environment with evolving technical priorities.

Nice-to-Haves

• Experience leading the end-to-end qualification of a new process, tool, or material into production or scaled R&D use.
• Experience mentoring engineers or technicians, or setting technical direction within a process area.
• Experience owning a process module through multiple technology generations or major equipment transitions.
• Track record of publications, patents, or documented internal process-capability improvements.
• Experience with superconducting thin films or device fabrication.
• Experience developing thin-film processes for semiconductor, superconducting, or quantum technologies.
• Hands-on experience with thin-film characterization techniques such as ellipsometry, AFM, SEM, XRR, XRD, or related methods.
• Experience analyzing engineering data using statistical methods and tools such as JMP, Python, MATLAB, or similar software.
• Exposure to quantum computing, cryogenic measurements, or superconducting device technologies.
• Experience working in a startup or R&D-focused engineering environment.

Compensation

• Annual salary range: $170,000–$200,000.