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3D Physical Design Engineer

Designs and analyzes 3D integrated ASIC/SoC products, optimizing power, performance, area, and handling verification, IR/EM, packaging, and cooling. Requires 10+ years experience in physical design flows, scripting, and 3D stacking technologies.

150k – 270kSunnyvale, CAHardware EngineeringOnsite10+ YOE

About the role

Responsibilities

  • Work on design and analysis of 3D integrated products.
  • Combine traditional ASIC/SoC physical design skills with packaging, power, clock, and cooling analysis.
  • Collaborate with architecture and RTL teams on R&D for novel 3D integration concepts.

Required Qualifications

  • 10+ years of physical design/verification experience.
  • Strong knowledge of block level and full-chip physical verification methodology.
  • Expert at optimizing for power/performance/area.
  • Experience with complete physical design flow (Synopsys tool suite a plus).
  • Expert with ICV or Calibre tools for resolving block and full-chip DRC/LVS issues.
  • Expert with IR/EM analysis and resolution.
  • Strong scripting in Tcl and Python for flow enhancements.
  • Ability to work with RTL teams to optimize for physical design.
  • Knowledge of 2.5D or 3D packaging solutions.
  • Experience with 3D physical design, 3D die stacking, 3D chip design, die-on-die, or wafer-on-wafer.

Preferred Qualifications

  • Experience with full chip floor planning and integration.
  • Knowledge of clock distribution.
  • Knowledge of cooling analysis.

Compensation

Salary range: $150,000 – $270,000 annually (based on experience, skills, qualifications, and location).

Skills

Physical DesignIcvCalibreDrcLvsIr/Em AnalysisTclPythonSynopsys Tools3D Ic DesignDie Stacking2.5D PackagingFloorplanningClock Distribution

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