Leads end-to-end mechanical architecture and integration of cryogenic quantum hardware, from room temperature infrastructure to millikelvin systems. Requires 7+ years of complex hardware design experience, advanced SolidWorks and simulation skills, and expertise in cryogenic or vacuum environments.
165k – 190k/yr
On-site7+ YOEHardware Engineering
About the role
Responsibilities
Cryogenic Hardware Design
Own the mechanical design of cryogenic hardware from 300 K to millikelvin, including thermal anchoring, RF wiring, flex interconnects, coaxial routing, filter housings, and connector packaging across temperature stages.
Lead the full design lifecycle from concept through CAD, GD&T drawings, BOMs, tolerance analysis, prototype builds, qualification testing, and manufacturing release.
Define cryogenic mechanical interfaces and thermal conduction budgets.
Drive design-for-manufacturability with external machine shops and precision vendors.
Simulation & Analysis
Perform mechanical, thermal, and vibration analyses using COMSOL, ANSYS, or equivalent.
Use simulation results to drive design decisions and iteration.
Conduct tolerance stack-up analyses for multi-component assemblies in constrained cryostat environments.
Integration, Leadership & Collaboration
Lead prototype builds, system integration, and cryogenic bring-up.
Diagnose integration failures and drive root-cause analysis.
Serve as the mechanical lead in cross-functional programs alongside quantum physicists, RF engineers, and systems teams.
Mentor junior engineers and lead design reviews.
Maintain rigorous documentation, including CAD models, drawings, BOMs, and revision-controlled design records within the company PLM system.
Requirements
B.S. or M.S. in Mechanical Engineering or a related field; M.S. preferred.
7+ years designing complex mechanical or electromechanical systems with end-to-end hardware ownership.
Expert-level SolidWorks experience, including large assemblies, GD&T-compliant drawing packages, and DFM workflows.
Independent proficiency in SolidWorks and COMSOL or ANSYS for thermal and structural analysis.
Experience with hardware operating in cryogenic, vacuum, or extreme thermal environments.
Strong mechanical engineering fundamentals, including stress analysis, tolerance stack-ups, materials selection, and failure mode analysis.
Proven ability to lead technical efforts and collaborate across multidisciplinary teams.
Nice-to-Haves
Direct experience with dilution refrigerators, cryostats, or sub-Kelvin systems in quantum computing or precision instrumentation.
Knowledge of superconducting quantum hardware architecture and millikelvin design constraints.
RF/microwave packaging experience, including connector specification, hermetic sealing, and cable routing in cryostats.
Familiarity with cleanroom protocols, vacuum-compatible assembly, and contamination-sensitive environments.
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