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Rigetti ComputingRigetti ComputingBerkeley, CA

Senior Mechanical | Cryogenic Engineer

Leads end-to-end mechanical architecture and integration of cryogenic quantum hardware, from room temperature infrastructure to millikelvin systems. Requires 7+ years of complex hardware design experience, advanced SolidWorks and simulation skills, and expertise in cryogenic or vacuum environments.

165k – 190k/yr
On-site7+ YOEHardware Engineering

About the role

Responsibilities

Cryogenic Hardware Design

  • Own the mechanical design of cryogenic hardware from 300 K to millikelvin, including thermal anchoring, RF wiring, flex interconnects, coaxial routing, filter housings, and connector packaging across temperature stages.
  • Lead the full design lifecycle from concept through CAD, GD&T drawings, BOMs, tolerance analysis, prototype builds, qualification testing, and manufacturing release.
  • Define cryogenic mechanical interfaces and thermal conduction budgets.
  • Drive design-for-manufacturability with external machine shops and precision vendors.

Simulation & Analysis

  • Perform mechanical, thermal, and vibration analyses using COMSOL, ANSYS, or equivalent.
  • Use simulation results to drive design decisions and iteration.
  • Conduct tolerance stack-up analyses for multi-component assemblies in constrained cryostat environments.

Integration, Leadership & Collaboration

  • Lead prototype builds, system integration, and cryogenic bring-up.
  • Diagnose integration failures and drive root-cause analysis.
  • Serve as the mechanical lead in cross-functional programs alongside quantum physicists, RF engineers, and systems teams.
  • Mentor junior engineers and lead design reviews.
  • Maintain rigorous documentation, including CAD models, drawings, BOMs, and revision-controlled design records within the company PLM system.

Requirements

  • B.S. or M.S. in Mechanical Engineering or a related field; M.S. preferred.
  • 7+ years designing complex mechanical or electromechanical systems with end-to-end hardware ownership.
  • Expert-level SolidWorks experience, including large assemblies, GD&T-compliant drawing packages, and DFM workflows.
  • Independent proficiency in SolidWorks and COMSOL or ANSYS for thermal and structural analysis.
  • Experience with hardware operating in cryogenic, vacuum, or extreme thermal environments.
  • Strong mechanical engineering fundamentals, including stress analysis, tolerance stack-ups, materials selection, and failure mode analysis.
  • Proven ability to lead technical efforts and collaborate across multidisciplinary teams.

Nice-to-Haves

  • Direct experience with dilution refrigerators, cryostats, or sub-Kelvin systems in quantum computing or precision instrumentation.
  • Knowledge of superconducting quantum hardware architecture and millikelvin design constraints.
  • RF/microwave packaging experience, including connector specification, hermetic sealing, and cable routing in cryostats.
  • Familiarity with cleanroom protocols, vacuum-compatible assembly, and contamination-sensitive environments.

Skills

SolidworkscomsolansysGD&Tdesign for manufacturingthermal analysisstructural analysisvibration analysistolerance stack-up analysiscryogenicsvacuum systemsrf packagingCADbom managementplm
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