Semiconductor Packaging Engineer
Develop and optimize semiconductor packaging processes, including innovative methods leveraging 3D printing for novel materials and end-to-end fabrication. Requires 5+ years packaging experience, strong materials and process knowledge, and a Master's in a relevant engineering field.
About the job
Responsibilities
- Working with the team to explore and validate innovative semiconductor packaging processes.
- Conducting hands-on lab experiments end-to-end to test.
- Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.
- Evaluating the process to continuously improve performance.
- Collaborating closely with team members to provide technical support for experiments and methodologies.
- Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.
Requirements
- Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field.
- 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.
- Knowledge of packaging materials, thermal management, and reliability testing.
- Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.
Nice-to-Haves
- Experience in 3D printing.
- Experience in metal plating.
- Mechanical-related background.
- Knowledge of electronic design.
Skills
Semiconductor Packaging, Lithography, Deposition, Die Attaching, Bonding, 3D Printing, Metal Plating, Thermal Management, Reliability Testing, Materials Science
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