Develop and optimize semiconductor packaging processes, including innovative methods leveraging 3D printing for novel materials and end-to-end fabrication. Requires 5+ years packaging experience, strong materials and process knowledge, and a Master's in a relevant engineering field.
115k – 180k/yr
On-site5+ YOEHardware Engineering
About the role
Responsibilities
Working with the team to explore and validate innovative semiconductor packaging processes.
Conducting hands-on lab experiments end-to-end to test.
Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.
Evaluating the process to continuously improve performance.
Collaborating closely with team members to provide technical support for experiments and methodologies.
Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.
Requirements
Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field.
5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.
Knowledge of packaging materials, thermal management, and reliability testing.
Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.
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