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Fab2Fab2Austin, TX

Semiconductor Packaging Engineer

Develop and optimize semiconductor packaging processes, including innovative methods leveraging 3D printing for novel materials and end-to-end fabrication. Requires 5+ years packaging experience, strong materials and process knowledge, and a Master's in a relevant engineering field.

115k – 180k/yr
On-site5+ YOEHardware Engineering

About the role

Responsibilities

  • Working with the team to explore and validate innovative semiconductor packaging processes.
  • Conducting hands-on lab experiments end-to-end to test.
  • Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.
  • Evaluating the process to continuously improve performance.
  • Collaborating closely with team members to provide technical support for experiments and methodologies.
  • Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.

Requirements

  • Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field.
  • 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.
  • Knowledge of packaging materials, thermal management, and reliability testing.
  • Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.

Nice-to-Haves

  • Experience in 3D printing.
  • Experience in metal plating.
  • Mechanical-related background.
  • Knowledge of electronic design.

Skills

semiconductor packaginglithographydepositiondie attachingbonding3d printingmetal platingthermal managementreliability testingmaterials science
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