Lead Engineer, Lithography

Required Qualifications

• Ph.D. with 7+ years or M.S. with 10+ years of direct experience in lithography process development and integration.
• Degree in Physics, Materials Science, Electrical Engineering, Chemical Engineering, or a related field.
• Proven hands-on mastery of the full lithography "wet" stack, including CAR/non-CAR resist chemistry, reaction kinetics, CD control, and sub-micron overlay management.
• Strong expertise in SPC, DOE, GR&R, and root-cause analysis; proficiency with JMP or similar statistical software to build diagnostic frameworks from the ground up.
• Proven ability to professionalize processes in R&D or semi-manual environments, translating "tribal knowledge" into scalable SOPs, recipes, and technical specifications.
• Hands-on proficiency with track systems, projection steppers, contact aligners, and maskless aligners (MLA).
• Ability to build process frameworks and drive technical strategy rather than just executing within existing ones.
• Demonstrated ability to manage ambiguity, prioritize module-level goals, and mentor junior engineering staff while maintaining deep hands-on technical engagement.
• Comfortable working in cleanroom environments (HAZMAT and ESD protocols).

Highly Desired Experience

• Experience partnering with E-beam hardware specialists to optimize the resist/process interface.
• Technical knowledge of proximity effect correction (PEC), dose strategy optimization, and multi-layer resist stacks.
• Expertise in managing charging and thermal stability challenges on non-standard or insulating substrates.
• Direct experience with DUV (KrF/ArF) or i-line projection lithography and the transition of processes to high-throughput production.
• Experience with ultrasonic spray-coating systems and lithography on high-topology or 3D surfaces.
• Proven success developing hybrid optical + e-beam workflows to ensure chemical compatibility and sub-50nm alignment precision.
• Prior experience in Quantum, MEMS, or Photonics fabrication environments.