Hands-on intern designs and iterates semiconductor packaging machines/subsystems, integrates mechanical/electrical/optical components, and performs wafer processing. Requires engineering student status, 1-2 lab experiences, mechanical engineering foundation, and prototyping portfolio.
105k – 126k/yr
On-site1+ YOEOther
About the role
Responsibilities
Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Required Experience
Pursuing a Bachelor’s Degree or higher in engineering
At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
Hands-on prototyping experience and the ability to move through design cycles quickly
Nice-to-have
Proven experience in mechatronics or electromechanical system design
Familiarity with lasering and 3D printing (stereolithography)
Reliability testing, soldering, and reflow testing
Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)
Compensation
Hourly rate equivalent to annualized $90,000-126,000 (40-hour week + up to 10 hours overtime at 1.5x)
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