Leads mechanical design and system integration for airborne or ruggedized hardware from concept through production. The role requires a mechanical engineering bachelor's degree, 8+ years of product development experience, strong CAD skills, and technical leadership across electrical, RF, manufacturing, and test teams.
130k – 200k/yr
On-site8+ YOEHardware Engineering
About the role
Responsibilities
Lead mechanical design and integration for airborne or ruggedized systems from concept through production.
Own system-level packaging of electronics, including radios, antennas, PCBAs, and harnessing.
Design and integrate components into composite and metallic structures.
Drive cross-functional collaboration across electrical, RF, manufacturing, and test teams.
Serve as project lead on select programs, managing scope, schedule, and technical execution.
Perform and guide structural, thermal, and environmental analyses.
Create and review CAD models, drawings, and production release packages.
Support prototype builds, integration, and troubleshooting in laboratory and field environments.
Ensure designs meet reliability, manufacturability, and performance requirements.
Act as a technical lead, drive design reviews and decision-making, mentor junior engineers, and balance speed with rigor.
Required Qualifications
Bachelor's degree in Mechanical Engineering or a related field.
8+ years of experience in mechanical design and product development.
Strong experience with CAD, such as NX, SolidWorks, or Creo.
Proven ability to take products from concept to production.
Experience working in cross-functional engineering environments.
Demonstrated ownership of projects or subsystems with minimal oversight.
Preferred Qualifications
Experience integrating radios, antennas, RF components, PCBAs, and embedded electronics into mechanical systems.
Familiarity with wiring and cable systems, including coax, RF cables, and harness design; RG-series and RMA considerations.
Experience designing composite structures and hybrid composite-metal assemblies.
Understanding of thermal management for electronics, including heat dissipation, airflow, and conduction paths.
Knowledge of grounding, shielding, and EMI/EMC considerations.
Experience with ground support equipment design or test infrastructure.
Familiarity with environmental requirements including vibration, shock, temperature, and ingress.
Experience working closely with RF or electrical engineering teams on system integration.
Hands-on build, integration, and troubleshooting experience.
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