Senior Embedded Engineering Program Manager

Responsibilities

• Own firmware program planning and execution across WHOOP’s NPI portfolio, ensuring alignment between product, engineering, and operational milestones from concept through launch.
• Develop and maintain integrated firmware schedules, roadmaps, and dependency tracking across multiple concurrent hardware projects.
• Partner with Firmware Engineering Leadership to drive prioritization, capacity planning, risk management, and execution readiness.
• Drive firmware milestone planning, including architecture readiness, feature development, integration, validation, manufacturing readiness, user acceptance testing and launch activities.
• Collaborate closely with Hardware, Connectivity, Sensor Intelligence, Automated Test Engineering, Manufacturing, and WHOOP Labs teams to identify and manage cross-functional dependencies throughout the product development lifecycle.
• Facilitate cross-functional program reviews, status updates, and executive communications, ensuring stakeholders have visibility into progress, risks, and tradeoffs.
• Identify schedule, technical, and resource risks early and lead mitigation planning across engineering and operational teams.
• Support development and validation efforts for Proto/EVT/DVT/PVT, manufacturing bring-up, and launch readiness activities.
• Establish scalable planning processes, tools, and reporting mechanisms to improve predictability and execution across embedded engineering programs.
• Partner with engineering leaders to continuously improve development workflows, release planning, and execution efficiency.

Qualifications

• Degree in Engineering or equivalent practical experience in firmware development.
• 5+ years of experience in Technical Program Management, Engineering Program Management, or related roles supporting embedded systems, firmware, or hardware product development.
• Experience leading complex embedded projects from concept through production release.
• Experience coordinating with hardware engineering, manufacturing, and global external partners.
• Strong understanding of embedded systems development, firmware release processes, and hardware-software integration challenges.
• Strong organizational, multi-tasking, and time management skills with the ability to thrive in fast-paced, ambiguous environments.
• Excellent communication and stakeholder management skills, both written and verbal.
• Ability to travel internationally to support engineering builds (up to 5%).