# Semiconductor Packaging Engineer

**Company:** [Fab2](https://hotfix.jobs/companies/fab2)
**Location:** Austin, TX
**Role:** Hardware Engineering
**Salary:** $115k – $180k/yr
**Experience:** 5+ years
**Skills:** semiconductor packaging, lithography, deposition, die attaching, bonding, 3d printing, metal plating, thermal management, reliability testing, materials science
**Posted:** 2026-07-21

> Develop and optimize semiconductor packaging processes, including innovative methods leveraging 3D printing for novel materials and end-to-end fabrication. Requires 5+ years packaging experience, strong materials and process knowledge, and a Master's in a relevant engineering field.

## Job Description

## Responsibilities
- Working with the team to explore and validate innovative semiconductor packaging processes.
- Conducting hands-on lab experiments end-to-end to test.
- Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.
- Evaluating the process to continuously improve performance.
- Collaborating closely with team members to provide technical support for experiments and methodologies.
- Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.

## Requirements
- Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field.
- 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.
- Knowledge of packaging materials, thermal management, and reliability testing.
- Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.

## Nice-to-Haves
- Experience in 3D printing.
- Experience in metal plating.
- Mechanical-related background.
- Knowledge of electronic design.

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