Advanced Packaging Multi-Physics Modeling Engineer
Leads multi-physics modeling and simulation for advanced AI/HPC packaging, optimizing thermal, mechanical, and electrical performance across chip, package, and system levels. Requires expertise in FEA tools like ANSYS/COMSOL and packaging technologies like CoWoS, HBM, chiplets.
Responsibilities
- Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems.
- Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability.
- Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures.
- Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures.
- Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability.
Requirements
- Strong experience in thermal and mechanical modeling for advanced packaging systems.
- Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
- Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches.
- Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent.
- Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions.
Preferred Qualifications
- Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications.
- Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
- Strong communication, cross-functional collaboration, and technical leadership skills.
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