# 3D Physical Design Engineer

**Company:** [Cerebras Systems](https://hotfix.jobs/companies/cerebras-systems)
**Location:** Sunnyvale, CA
**Role:** Hardware Engineering
**Salary:** $150k – $270k/yr
**Experience:** 10+ years
**Skills:** Physical Design, Icv, Calibre, Drc, Lvs, Ir/Em Analysis, Tcl, Python, Synopsys Tools, 3D Ic Design, Die Stacking, 2.5D Packaging, Floorplanning, Clock Distribution
**Posted:** 2026-04-27

> Designs and analyzes 3D integrated ASIC/SoC products, optimizing power, performance, area, and handling verification, IR/EM, packaging, and cooling. Requires 10+ years experience in physical design flows, scripting, and 3D stacking technologies.

## Job Description

## Responsibilities
- Work on design and analysis of 3D integrated products.
- Combine traditional ASIC/SoC physical design skills with packaging, power, clock, and cooling analysis.
- Collaborate with architecture and RTL teams on R&D for novel 3D integration concepts.

## Required Qualifications
- 10+ years of physical design/verification experience.
- Strong knowledge of block level and full-chip physical verification methodology.
- Expert at optimizing for power/performance/area.
- Experience with complete physical design flow (Synopsys tool suite a plus).
- Expert with ICV or Calibre tools for resolving block and full-chip DRC/LVS issues.
- Expert with IR/EM analysis and resolution.
- Strong scripting in Tcl and Python for flow enhancements.
- Ability to work with RTL teams to optimize for physical design.
- Knowledge of 2.5D or 3D packaging solutions.
- Experience with 3D physical design, 3D die stacking, 3D chip design, die-on-die, or wafer-on-wafer.

## Preferred Qualifications
- Experience with full chip floor planning and integration.
- Knowledge of clock distribution.
- Knowledge of cooling analysis.

## Compensation
Salary range: $150,000 – $270,000 annually (based on experience, skills, qualifications, and location).

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