# PCB Designer

**Company:** [Northwood Space](https://hotfix.jobs/companies/northwood-space)
**Location:** Los Angeles, CA
**Role:** Hardware Engineering
**Salary:** $100k – $150k/yr
**Experience:** 3+ years
**Skills:** Altium Designer, Cadence Allegro, Siemens Xpedition, Solidworks, Python, Skill, Fpga, Ddr, Ethernet, Serdes
**Posted:** 2026-06-04

> Northwood is seeking a PCB Designer to lead the physical layout and development of next-generation digital compute and power electronics. This role involves owning complex PCB layouts, managing high-speed constraint rules, and collaborating with engineering and production teams.

## Job Description

## RESPONSIBILITIES
* Own the physical layout of complex, high-density, and high-layer-count PCBs featuring high-speed digital, RF, mixed-signal, and power distribution systems.
* Determine optimum layer stackups, perform component placement, routing feasibility studies, and manage strict high-speed constraint rules.
* Perform ECAD library creation, management, and maintenance for a wide array of active, passive, and high-pin-count components.
* Collaborate across hardware and production teams to ensure strict adherence to Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) guidelines.
* Generate and release comprehensive documentation packages for fabrication and assembly (Gerbers, ODB++, IPC-2581, drill charts, fabrication drawings).
* Work closely with external PCB fabrication and assembly vendors to resolve technical queries (EQs) and continuously improve internal design rules.
* Utilize and evaluate advanced PCB design tools, maintaining internal design standards and automation scripts.

## BASIC QUALIFICATIONS
* 3–5+ years of professional experience in complex, high-density PCB layout (or a Bachelor’s degree in Electrical Engineering/related field with 2+ years of experience).
* Proficient in high-speed layout techniques (impedance control, differential pairs, length matching, and crosstalk mitigation).
* Experience with advanced packaging technologies, including fine-pitch BGAs, high-pin-density components, and microvias (HDI).
* Knowledge of PCB materials, dielectric properties, and developing multi-layer board stackups.
* Familiarity with layout considerations for EMI/EMC mitigation and robust power delivery networks (PDN).

## PREFERRED SKILLS AND EXPERIENCE
* 5+ years of experience designing high-speed, mixed-signal PCBs for FPGA, processor, or high-performance networking systems.
* Deep expertise in routing high-speed interfaces such as multi-gigabit SerDes, DDR memory, JESD204B/C, and 10/100G Ethernet.
* Advanced proficiency in industry-standard ECAD tools (Altium Designer, Cadence Allegro, or Siemens Xpedition).
* Strong understanding of IPC standards (e.g., IPC-2221, IPC-7351) and commercial manufacturing tolerances.
* Experience with ECAD/MCAD co-design and integration workflows (e.g., SolidWorks, STEP files) for tight mechanical constraints.
* Experience with scripting or automation (e.g., Python, Skill, or Altium scripts) to optimize layout workflows.
* Excellent communication skills and a proven ability to make sound layout tradeoffs in a fast-paced, collaborative hardware environment.

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