# PCB Design Engineer

**Company:** [Omi](https://hotfix.jobs/companies/omi)
**Location:** Shenzhen, China
**Role:** Hardware Engineering
**Salary:** CN¥416k – CN¥416k/yr
**Skills:** Kicad, Pcb Layout, Schematic Capture, Multilayer Pcb Design, Rf Layout, Antenna Design, Bluetooth Low Energy, Signal Integrity, Impedance-Controlled Routing, DFM, Flex Pcb, Rigid-Flex Pcb
**Posted:** 2026-05-19

> Designs compact, high-density multilayer PCBs for wearable AI hardware, owning schematics, layout, RF, signal integrity, and manufacturing collaboration. Strong KiCad experience and a track record with constrained-form-factor boards are required.

## Job Description

## Responsibilities
- Capture schematics and create high-density PCB layouts in KiCad.
- Design compact multilayer boards with 4–8+ layers under aggressive area and height constraints.
- Handle antenna layout and RF tuning for BLE and other wireless protocols.
- Perform signal-integrity work and impedance-controlled routing.
- Conduct design-for-manufacturing (DFM) reviews and collaborate with contract manufacturers in Shenzhen.

## Requirements
- Strong KiCad experience.
- Proven experience designing 4+ layer boards in tight form factors, such as wearables, earbuds, or IoT devices.
- Experience with antenna design and RF layout.
- Experience working with Shenzhen manufacturers.

## Nice-to-have
- Flex or rigid-flex PCB design experience.

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**Apply:** https://hotfix.jobs/jobs/2c3cb439-3cc9-4adb-ba23-929261a57792
**Canonical:** https://hotfix.jobs/jobs/2c3cb439-3cc9-4adb-ba23-929261a57792