# Advanced Packaging Reliability Engineer

**Company:** [OpenAI](https://hotfix.jobs/companies/openai)
**Location:** San Francisco, CA
**Role:** Hardware Engineering
**Salary:** $266k – $445k/yr
**Experience:** 8+ years
**Skills:** Finite Element Analysis, Thermal Modeling, Mechanical Modeling, Electromigration, Semiconductor Packaging, 2.5D Integration, 3.5D Integration, Hbm Integration, Root Cause Analysis, Package Qualification
**Posted:** 2026-06-16

> Lead reliability engineering for advanced HPC packages in AI systems. Assess mechanical/thermal risks, develop test plans, perform modeling, and drive design optimizations with cross-functional teams.

## Job Description

## Responsibilities
- Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development.
- Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability.
- Develop, validate, and apply package reliability models and lifetime-prediction methodologies for assembly, qualification, and product operating conditions.
- Evaluate and recommend package architectures, structural designs, materials, and assembly processes to maximize reliability performance and manufacturing robustness.
- Predict electromigration lifetime of package interconnects under product-specific current, temperature, workload, duty-cycle, and PCB boundary conditions.

## Requirements
- 8+ years of industry experience & knowledge of semiconductor package reliability principles and failure mechanisms, including electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, and material degradation.
- In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.
- Demonstrated experience leading package failure investigations, performing root-cause analysis, and implementing effective design, material, process, or manufacturing corrective actions.
- Strong experience with thermal and mechanical finite-element modeling of packages, including temperature distribution, warpage, stress, strain, fatigue, and interfacial reliability.
- Strong understanding of package-material behavior, including coefficient of thermal expansion, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity, and temperature-dependent properties.

## Nice-to-Haves
- Experience developing electromigration or interconnect lifetime models for solder joints, vias, redistribution layers, interposers, or package power-delivery structures.
- Knowledge of package qualification methods, acceleration models, thermal cycling, power cycling, current-stress testing, and reliability lifetime extrapolation.
- Familiarity with package failure-analysis techniques such as acoustic microscopy, X-ray imaging, cross-sectioning, scanning electron microscopy, and material characterization.
- Experience supporting package-integrated voltage regulation, high-current power delivery, or high-transient-current AI and HPC products.
- MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
- Strong communication, cross-functional collaboration, and technical leadership skills.

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